ETME 215 Homework 6 (100 pts) Due 11/16/2020
Q1. Give three reasons why so many different welding processes have been developed over the years. (5)
Q2. Explain why some joints may have to be preheated prior to welding? (5)
Q3. What are two advantages of electron-beam and laser-beam welding compared with arc welding? (5)
Q4. Explain the significance of residual stresses in welded structures? How it impacts the mechanical
properties of the welded parts (5)?
Q5. List ten wielding processes you learned in ETME 215? (10)
Q 6. Explain how adhesives can be made to be electrically conductive. (5)
Q 7. Give five reasons why adhesively bonded joints tend to be weak in peeling? (10)
Q 8. What joining methods would be suitable for assembling a thermoplastic cover over a metal frame? (5)
Q 9. Describe the difference between isotropic etching and anisotropic etching. (5)
Q10. Describe the difference between a microelectronic device, a micromechanical device and MEMS. (10)
Q11. List three advantages and three disadvantages of surface micromachining compared with bulk
micromachining.? (10)
Q12. Identify five factors that can cause a process to become out of control. (10)
Q13. Why is reliability important in manufacturing engineering? Give two examples? (5)
Q14. The average of averages of a number of samples of size 7 was determined to be 125. The average
range was 17.82 and the standard deviation was 5.85. The following measurements were taken in a
sample: 120, 143, 124, 130, 105, 132, and 121. Is the process in control? (ETME 215 Homework 6 (100 pts) Due 11/16/2020
Q1. Give three reasons why so many different welding processes have been developed over the years. (5)
Q2. Explain why some joints may have to be preheated prior to welding? (5)
Q3. What are two advantages of electron-beam and laser-beam welding compared with arc welding? (5)
Q4. Explain the significance of residual stresses in welded structures? How it impacts the mechanical
properties of the welded parts (5)?
Q5. List ten wielding processes you learned in ETME 215? (10)
Q 6. Explain how adhesives can be made to be electrically conductive. (5)
Q 7. Give five reasons why adhesively bonded joints tend to be weak in peeling? (10)
Q 8. What joining methods would be suitable for assembling a thermoplastic cover over a metal frame? (5)
Q 9. Describe the difference between isotropic etching and anisotropic etching. (5)
Q10. Describe the difference between a microelectronic device, a micromechanical device and MEMS. (10)
Q11. List three advantages and three disadvantages of surface micromachining compared with bulk
micromachining.? (10)
Q12. Identify five factors that can cause a process to become out of control. (10)
Q13. Why is reliability important in manufacturing engineering? Give two examples? (5)
Q14. The average of averages of a number of samples of size 7 was determined to be 125. The average
range was 17.82 and the standard deviation was 5.85. The following measurements were taken in a
sample: 120, 143, 124, 130, 105, 132, and 121. Is the process in control? (10)

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